Chinese Journal of Applied Chemistry ›› 2022, Vol. 39 ›› Issue (6): 859-870.DOI: 10.19894/j.issn.1000-0518.220031

• Review •     Next Articles

Advanced Materials for Lithography

Zi-Li LI1(), Xing-Ran XU1,2, Jiang-Hao ZHAN1, Xiao-Hua HU1, Zi-Ying ZHANG2, Shi-Sheng XIONG1()   

  1. 1.Center of Micro-Nano System,School of Information Science and Technology,Fudan University,Shanghai 200438,China
    2.School of Materials Engineering,Shanghai University of Engineering Science,Shanghai 201620,China
  • Received:2022-02-11 Accepted:2022-04-14 Published:2022-06-01 Online:2022-06-27
  • Contact: Zi-Li LI,Shi-Sheng XIONG
  • About
  • Supported by:
    the National Natural Science Foundation of China(U20A20227);Startup Funding of Fudan University(JIH1232090)


With the technological development and progresses of the semiconductor industry, chip manufacturing is stepping forward to the advanced technology nodes under the impetus of Moore's Law. Meanwhile, the corresponding advanced materials for lithography are highly desired to satisfy the rapid development of advanced lithographic patterning. This review focuses on the composition and performances of materials for lithography. The photoresist from ultraviolet, deep ultraviolet, and extreme ultraviolet light as well as semiconducting photoresist and materials for directed self-assembly (DSA) are systematically summarized. Subsequently, the current market development and requirement of materials for lithography are critically examined. Finally, after a brief summary, an outlook for the prospective studies on advanced materials for lithography and the corresponding solutions to improve the domestic market occupancy is provided.

Key words: Advanced lithography, Directed self-assembly lithography, Photoresist, Semiconducting photoresist, Chemically amplified photoresists

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