Photoresist Film-Forming Agent: Development and Future

doi:10.19894/j.issn.1000-0518.210152

Chinese Journal of Applied Chemistry ›› 2021, Vol. 38 ›› Issue (9): 1079-1090.DOI: 10.19894/j.issn.1000-0518.210152

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Photoresist Film-Forming Agent: Development and Future

PENG Xiao-Kang, HUANG Xing-Wen, LIU Rong-Tao, ZHANG Yong-Wen, ZHANG Shi-Yang, LIU Yi-Dong, MIN Yong-Gang^*

School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China

Received:2021-03-30 Accepted:2021-04-30 Published:2021-09-01 Online:2021-09-06
Supported by:
Program for Guangdong Introducing Innovative and Entrepreneurial Team (No.2016ZT06C412)

Abstract

Abstract: With the advancement of integrated circuit manufacturing towards 3 nm or 1 nm, photoresist, utilizing as the important consumable for the most complicated lithography process in integrated circuit manufacturing, has become increasingly important and challenging. Photoresist has experienced the development from ultraviolet to deep ultraviolet and then to extreme ultraviolet following the steps of exposure light source. In this review, firstly, the development and application of ultraviolet photoresist and deep ultraviolet photoresist are summarized from the perspective of film-forming agent, and then the performance requirements of extreme ultraviolet photoresist are briefly described. Finally, the molecular glass system utilized in extreme ultraviolet photoresist is introduced and prospected.

Key words: Ultraviolet photoresist, Deep ultraviolet photoresist, Extreme ultraviolet photoresist, Chemical amplification, Molecular glass

CLC Number:

O649

PENG Xiao-Kang, HUANG Xing-Wen, LIU Rong-Tao, ZHANG Yong-Wen, ZHANG Shi-Yang, LIU Yi-Dong, MIN Yong-Gang. Photoresist Film-Forming Agent: Development and Future[J]. Chinese Journal of Applied Chemistry, 2021, 38(9): 1079-1090.

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Photoresist Film-Forming Agent: Development and Future

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