Structure and the Thermal Stability of Electrodeposited Ni-W-P Alloy-Films on Silicon

Chinese Journal of Applied Chemistry ›› 1998, Vol. 0 ›› Issue (3): 35-38.

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Structure and the Thermal Stability of Electrodeposited Ni-W-P Alloy-Films on Silicon

Li Aichang¹, Zhang Guoqing², Liu Bing²

1. Department of Chemistry, Langfang Teacher's College, Langfang 065000;
2. Department of Applied Chemistry, Tianjin University, Tianjin

Received:1997-11-21 Revised:1998-03-20 Published:1998-06-10 Online:1998-06-10

Abstract

Abstract: It is found that the electroplating time affected the chemical composition of the electrodeposited Ni-W-P alloy films on p-silicon and their structures. The DTA results showed that the crystal structure of the amorphous Ni-W-P film does not change drastically at 200 ℃ to 500 ℃ under N₂. The Ni-W-P film has better thermal stability than that of amorphous Ni-P film.

Key words: p-type silicon, electrodeposited Ni-W-P film, structure, thermal stability

Li Aichang, Zhang Guoqing, Liu Bing. Structure and the Thermal Stability of Electrodeposited Ni-W-P Alloy-Films on Silicon[J]. Chinese Journal of Applied Chemistry, 1998, 0(3): 35-38.

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Structure and the Thermal Stability of Electrodeposited Ni-W-P Alloy-Films on Silicon

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