Abstract: According to the nature of copper, γ-amino propyl methyl di-ethoxy-silane(KH-902) is selected to modify copper. FT-IR, digital microscope, TG, SEM and EDS have been used to characterize the modified copper and the copper-filled conductive adhesive. The results show that the addition of silane coupling agent KH-902 can improve the antioxidation ability. When the addition of KH-902 is 3%, it can significantly improve not only the oxidation resistance of the copperfilled conductive adhesive in high temperature curing, but also the dispersion of copper in the epoxy resin colloid system, and make the combination between copper and copper better, which is the superior conductivity of system with bulk resistance rate of 1.31×10-2 Ω·cm.

Key words: Filled Conductive Adhesive, copper, silane coupling agent, oxidation resistance