光刻胶成膜剂:发展与未来

doi:10.19894/j.issn.1000-0518.210152

摘要/Abstract

摘要： 随着集成电路制程向着3 nm乃至1 nm推进,光刻胶作为集成电路制造中最为繁杂的光刻工艺所需的重要耗材,愈发显示其重要性及挑战性。光刻胶随曝光光源的进步经历了从紫外到深紫外再到极紫外的发展,本文从成膜剂角度首先综述了紫外光刻胶及深紫外光刻胶的发展应用情况,接着对极紫外光刻胶的性能需求作了简述,最后重点针对极紫外光刻胶中的分子玻璃体系作了介绍及展望。

关键词: 紫外光刻胶, 深紫外光刻胶, 极紫外光刻胶, 化学增幅, 分子玻璃

Abstract: With the advancement of integrated circuit manufacturing towards 3 nm or 1 nm, photoresist, utilizing as the important consumable for the most complicated lithography process in integrated circuit manufacturing, has become increasingly important and challenging. Photoresist has experienced the development from ultraviolet to deep ultraviolet and then to extreme ultraviolet following the steps of exposure light source. In this review, firstly, the development and application of ultraviolet photoresist and deep ultraviolet photoresist are summarized from the perspective of film-forming agent, and then the performance requirements of extreme ultraviolet photoresist are briefly described. Finally, the molecular glass system utilized in extreme ultraviolet photoresist is introduced and prospected.

Key words: Ultraviolet photoresist, Deep ultraviolet photoresist, Extreme ultraviolet photoresist, Chemical amplification, Molecular glass

中图分类号:

O649

朋小康, 黄兴文, 刘荣涛, 张永文, 张诗洋, 刘屹东, 闵永刚. 光刻胶成膜剂:发展与未来[J]. 应用化学, 2021, 38(9): 1079-1090.

PENG Xiao-Kang, HUANG Xing-Wen, LIU Rong-Tao, ZHANG Yong-Wen, ZHANG Shi-Yang, LIU Yi-Dong, MIN Yong-Gang. Photoresist Film-Forming Agent: Development and Future[J]. Chinese Journal of Applied Chemistry, 2021, 38(9): 1079-1090.

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