Abstract: The superhydrophobic film on copper surface was fabricated by immersing copper substrate in palmitic acid dissovled in ethanol. The optimal conditions for fabricating the superhydrophobic film on copper are: 0.03 mol/L palmitic acid in ethanol solution, temperature of 20～22 ℃ and 144 h of immersion. The resultant superhydrophobic film was characterized and analyzed by means of scanning electron microscopy(SEM), contact angle goniometer, Fourier-transform infrared spectrometer(FTIR) and high precision electronic balance, respectively. The results showed that it was the grass-like Cu(CH3(CH2)14COO)2 microcluster with dimensional size in the range of 100～200 μm that was responsible for its hydrophobic property. The water contact angle of superhydrophobic surface is 150°. The superhydrophobic surface on copper showed superior anti-fouling performance.

Key words: superhydrophobic films, copper, solution-immersion, anti-fouling