ELECTROPOLISHING BEHAVIOR OF ORGANOPHOSPHONIC ACID AND CQMPOSITION OF VISCOUS FILM ON ELECTROPOLISHED COPPER SURFACE

Chinese Journal of Applied Chemistry ›› 1990, Vol. 0 ›› Issue (1): 53-57.

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ELECTROPOLISHING BEHAVIOR OF ORGANOPHOSPHONIC ACID AND CQMPOSITION OF VISCOUS FILM ON ELECTROPOLISHED COPPER SURFACE

Fang Jingli, Ding Jianping, Wu Naijun

Institute of Applied Chemistry, Nanjing University, Nanjing 210008

Received:1989-04-11 Revised:1989-07-06 Published:1990-02-10 Online:1990-02-10

Abstract

Abstract: The electropolishing behavior of tive organopolyphosphonic acids has been studied. Theresults showed that 1-hydroxyethylidene-1,1-diphosphonic acid(HEDP), 1-ethylphosphono-ethylidene-1, 1-diphosphonic acid(EEDP)and N, N′-dimethylidene-phosphonoglycine(DMPG)can be used for electropolishing copper and its allcy,and among them the HEDP gave thebest result.Viscous liquid film was observed in all conditions used, such as HEDP concen-trations,pH of solutions and kind of electropolishing solution(H₃PO₄,HEDP, and H₃PO₄+HEDP). Detection of phosphorus in electropolished copper surface was made by XPS and Augerline.No phosphorus was found. The viscous liquid film obtained from H₃PO₄+HEDP solution possesses very goodfilm-forming characteristics., The composition of the viscous film can be established fromthe constant composition region of the depth profile curve and may be considered to be apolynuclear coordination polymeric compound [Cu₄(PO₄)(HEDP)_n]

Key words: organopolyphosphonic acid, electropolishing, XPS, copper

Fang Jingli, Ding Jianping, Wu Naijun. ELECTROPOLISHING BEHAVIOR OF ORGANOPHOSPHONIC ACID AND CQMPOSITION OF VISCOUS FILM ON ELECTROPOLISHED COPPER SURFACE[J]. Chinese Journal of Applied Chemistry, 1990, 0(1): 53-57.

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ELECTROPOLISHING BEHAVIOR OF ORGANOPHOSPHONIC ACID AND CQMPOSITION OF VISCOUS FILM ON ELECTROPOLISHED COPPER SURFACE

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