Chinese Journal of Applied Chemistry

• Communications • Previous Articles     Next Articles

Processability Improvement of Polyimide by Adding Asymmetric Structure in Molecular Chain

ZHU Danyang1, WANG Ying2, ZHANG Chunhua1, WU Zuolin1, HAN Baochun1, YANG Zhenghua1*   

  1. (1.Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,Changchun 130022,China;
    2.Avic Shaanxi Baocheng Aviation Instrument Corporation Limited,Baoji 721006,China)
  • Received:2012-04-13 Revised:2012-06-28 Published:2013-02-10 Online:2013-02-10

Abstract: A series of high-strength and processable polyimide(PI) moulding compounds with different content of diamine was prepared from 3,3′,4,4′-biphenyl tetracarboxylic diandhydride(BPDA) and 4,4′-diaminodiphenyl ether(4,4′-ODA), 3,4′-diaminodiphenyl ether(3,4′-ODA) through chemical imiidization. The rheological,mechanical and thermal resistance properties of the PI moulding compounds were investigated. With the increasing of 3,4′-ODA content, the impact strength of the PI could be maintained without dramatic change. The rheological properties of the PI were enhanced and the glass transition temperature can reach 275 ℃. The impact strength of the PI is about 141 kJ/m2. Processability of the PI is superior at 20 MPa.

Key words: biphenyl tetracarboxylic diandhydride, polyimide, moulding compound, rheological property

CLC Number: