Research on the Process and Performance of Low Dielectric Constant Photosensitive Polyimide

doi:10.19894/j.issn.1000-0518.250353

Chinese Journal of Applied Chemistry ›› 2026, Vol. 43 ›› Issue (3): 411-421.DOI: 10.19894/j.issn.1000-0518.250353

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Research on the Process and Performance of Low Dielectric Constant Photosensitive Polyimide

Shun SHI, Jiao-Jiao MA(), Ze-Yu LI, Chun-Hua ZHANG, Hai-Quan GUO()

Polymer Materials Engineering Laboratory，Changchun Institute of Applied Chemistry，Chinese Academy of Sciences，Changchun 130022，China

Received:2025-09-09 Accepted:2025-11-06 Published:2026-03-01 Online:2026-03-26
Contact: Jiao-Jiao MA,Hai-Quan GUO
About author:jjma@ciac.ac.cn
hqguo@ciac.ac.cn；
Supported by:
the National Key Research and Development Program(2022YFB3806600);Guangzhou Science and Technology Program Project(202206070002)

Abstract

Abstract:

Photosensitive polyimide （PSPI） has important applications in high-density integrated circuits and advanced packaging. Reducing the dielectric constant and dielectric loss of PSPI can effectively reduce signal delay and signal loss during high-frequency high-speed transmission. This paper systematically studies the structural design of low-dielectric-loss photosensitive polyimide and the effects of its light curing and thermal curing processes on its dielectric properties. By manipulating the fluorine-containing groups and alicyclic structures， a series of PSPI with low dielectric constant and low dielectric loss were designed. It reveals the different impacts of various thermal curing temperatures （200~350 ℃） and different processing techniques such as post-light curing and then thermal curing on the dielectric constant and dielectric loss of PSPI. Experimental results show that with high-temperature thermal curing alone， the dielectric constant （Dk） and dielectric loss （Df） of PSPI decrease with increasing curing temperature （Dk=3.1~2.6， 200~350 °C）， while samples that are light cured and then thermally cured can also achieve low dielectric constants （Dk=3.0~2.4， 200~350 ℃） and low dielectric loss， while maintaining excellent mechanical properties and thermal stability. This study provides a theoretical basis for the structural design and application of high-performance low-dielectric-loss PSPI.

Key words: Photosensitive polyimide, Photopolymerization, Thermosetting, Dielectric properties

CLC Number:

O625

Shun SHI, Jiao-Jiao MA, Ze-Yu LI, Chun-Hua ZHANG, Hai-Quan GUO. Research on the Process and Performance of Low Dielectric Constant Photosensitive Polyimide[J]. Chinese Journal of Applied Chemistry, 2026, 43(3): 411-421.

Figures/Tables 13

Fig.1 Synthesis of polymer PAE-1

Fig.2 Structure of PAE-1， PAE-2 and PAE-3

Table 1 The relative molecular mass and its distribution of films from three different processing techniques

Sample	M_n	M_w	PDI
PI-1-350	56 825	105 695	1.86
PI-2-350	51 743	88 998	1.72
PI-3-350	48 267	77 710	1.61
PSPI-1-350	7 877	38 726	4.92
PSPI-2-350	6 169	29 589	4.80
PSPI-3-350	6 028	18 494	3.07
PSPI-1-hv-350	7 423	39 736	5.35
PSPI-2-hv-350	6 382	28 947	4.54
PSPI-3-hv-350	6 184	21 475	3.47

Fig.3 FT-IR spectra of three different process films

Fig.4 Three different processes obtain the dielectric constant （A） and dielectric loss （B） of the film

Fig.5 Dielectric constant （A） and dielectric loss （B） of PSPI-1 subjected to thermal curing at different temperatures and thermal curing after irradiation

Fig.6 Dielectric constant （A） and dielectric loss （B） of PSPI-2 subjected to thermal curing at different temperatures and thermal curing after irradiation

Fig.7 Dielectric constant （A） and dielectric loss （B） of PSPI-3 subjected to thermal curing at different temperatures and thermal curing after irradiation

Fig.8 Dielectric constant （A） and dielectric loss （B） of polymer after curing and reheat curing after irradiation

Fig.9 Thermal performance data： DMA storage modulus curve （A）， DMA loss angle curve （B）， TMA curve （C） and TGA curve （D） of polymer after curing and reheat curing after irradiation

Fig.10 Stress-strain curves of PI and PSPI-hv

Fig.11 Moisture absorption rates of PI， PSPI and PSPI-hv under three different processing methods

Fig.12 Lithographic resolution of three polymers

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Research on the Process and Performance of Low Dielectric Constant Photosensitive Polyimide

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