Abstract:

Nano-porous copper film was prepared by sol-gel electroplating. Using copper sheet as anode, the effects of the plating solution composition, plating time, cathode substrate and plating voltage on the morphology of the plating layer were investigated in the plating voltage at 5 V. Scanning electron microscopy and X-ray diffraction methods were utilized to analyze the morphology and crystal forms to obtain the optimum conditions for preparing the copper films. The particle size of the copper film is about 100 nm, grain size is about 25 nm, and an enhanced (111) texture exists in the cooper film. XRD analysis depicts that the attached chitosan gel protects the copper film from being oxidized. The plating current tends to be stable at a low value after a certain time of plating. Chitosan gel prevents further deposition of copper ions in the bath on the substrate.

Key words: chitosan, copper, nanoporous film