应用化学 ›› 2019, Vol. 36 ›› Issue (6): 658-663.DOI: 10.11944/j.issn.1000-0518.2019.06.180352

• 研究论文 • 上一篇    下一篇

耐超高温双酮酐型聚酰亚胺的合成及性能

刘勇军,周丽云,盛寿日,宋琤(),侯豪情,宋才生   

  1. 江西师范大学化学化工学院 南昌 330022
  • 收稿日期:2018-11-06 接受日期:2019-01-14 出版日期:2019-06-01 发布日期:2019-06-03
  • 通讯作者: 宋琤
  • 基金资助:
    国家自然基金(51663011)江西省教育厅科学技术研究项目(GJJ170177)资助

Synthesis and Properties of Super-high Temperature Diketone Anhydride Polyimides

LIU Yongjun,ZHOU Liyun,SHENG Shouri,SONG Cheng(),HOU Haoqing,SONG Caisheng   

  1. College of Chemistry and Chemical Engineering,Jiangxi Normal University,Nanchang 330022,China
  • Received:2018-11-06 Accepted:2019-01-14 Published:2019-06-01 Online:2019-06-03
  • Contact: SONG Cheng
  • Supported by:
    Supported by the National Natural Science Foundation of China(No.51663011), Science and Technology Research Project of Jiangxi Provincial Department of Education(No.GJJ170177)

摘要:

以4,4'-对苯二甲酰二邻苯二甲酸酐(TDPA)为芳二酐单体,对苯二胺(PPD)为芳二胺单体,经低温溶液缩聚制得成膜性能优良的高相对分子质量聚酰胺酸(PAA),再经过热亚胺化制备双酮酐型聚酰亚胺(PI)薄膜。 采用傅里叶变换红外光谱仪(FT-IR)、广角X射线衍射(WAXD)、差示扫描量热仪(DSC)、动态热机械分析仪(DMA)、热重分析仪(TGA)、紫外-可见分光光度计(UV-Vis)及力学性能等技术手段表征了聚酰亚胺膜的结构和性能,考察了不同亚胺化温度对合成的双酮酐型聚酰亚胺膜性能的影响。 结果表明,经程序升温至320 ℃能使PAA热亚胺化基本趋于完成。 PI薄膜为部分有序聚集态结构,玻璃化转变温度(Tg)为298 ℃,具有优异的热性能,热失重温度(T5%)为523 ℃。 拉伸强度达到130 MPa,弹性模量为5.77 GPa。 PI薄膜紫外光透过截止波长为375 nm,在可见光区具有良好的透光性能及耐溶剂性能。

关键词: 双酮酐型聚酰亚胺, 热性能, 透光性能

Abstract:

A novel diketone anhydride polyimide was synthesized by introducing p-phenylenediamine(PPD) to 4,4'-terephthaloyldiphthalic anhydride through the traditional two-step method in dimethylacetamide(DMAc). The properties of the polyimide were characterized by Fourier transform infrared spectrometer(FT-IR), wide-angle X-ray diffraction(WAXD), differential scanning calorimetric(DSC), dynamic thermomechanical analyzer(DMA), thermal gravimetric analysis(TGA), tensile test and ultraviolet-visible spectrophotometry(UV-Vis). The relationship between different thermal imidization temperature and the properties of the diketone polyimide was studied. The results showed that PAA formed the imide ring structure completely at 320 ℃. The polyimide had good film-forming performance and partially ordered aggregate structure. The polyimide had excellent thermal properties: the glass transition temperature(Tg) was 298 ℃ and the thermal decomposition temperature(T5%) was 523 ℃. The film had a tensile strength of 130 MPa and tensile modulus of 5.77 GPa at 320 ℃. The cutoff wavelength of the film was 375 nm and the film had good transmittance in visible region.

Key words: diketone anhydride polyimide, thermal properties, transmittance