中华医学超声杂志

应用化学 ›› 1994, Vol. 0 ›› Issue (3): 54-57.

• 研究论文 • 上一篇    下一篇

有机硅耐磨透明涂层的固化分析

杨柏, 高长有, 孙允秀, 沈家骢   

  1. 吉林大学化学系 长春 130023
  • 收稿日期:1993-10-22 修回日期:1994-01-14 出版日期:1994-06-10 发布日期:1994-06-10

Curing Analysis of transparent,Abrasion-resistant Organosilicone Coatings

Yang Bai, Gao Changyou, Sun Yunxiu, Shen Jiacong   

  1. Department of Chemistry, Jilin University, Changchun 130023
  • Received:1993-10-22 Revised:1994-01-14 Published:1994-06-10 Online:1994-06-10

PDF

493

被引次数

35 | 10

摘要： FTIR、TG、TBA等对有机硅耐磨涂料(有机硅溶胶)的热固化过程研究表明有机硅胶体中缔合羟基间的脱水缩合速率很高;羟基脱水程度与固化温度有关,温度越高,达平衡时羟基的浓度越低,在105～130℃间羟基的浓度变化最大,加入适当的固化剂,对羟基的脱水交联有促进作用,在较高的固化温度下,反应体系中出现了环氧环异构化产生的酮羰基的吸收峰。

关键词: 耐磨涂料, 透明涂层, 固化工艺, 溶胶－凝胶法, 有机硅氧烷

Abstract: FTIR,TG and TBA tochniques have been used to study the curing process of abrasion-resistant organosilicone coatings used for transparent plastics. The dehydration rate of the associated hydroxy groups in the organosilicone colloid was very fast at the initial time,while the dehydration degree was higher at higher curing temperatures,especially at 105～130℃. The absorbtion peak appeared at 1728.9cm-1 is attributed to the acetyl group due to the isomerization of oxirane in KH-560.

Key words: abrasion-resistant coating, transparent film, organosilicone, sol-gel method, curing process

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