应用化学 ›› 1998, Vol. 0 ›› Issue (4): 95-97.

• 研究论文 • 上一篇    下一篇

取代脲促进环氧树脂/双氰胺固化体系反应机理

张保龙, 石可瑜, 由英才, 周德亮, 杜宗杰, 黄吉甫   

  1. 南开大学化学系, 吸附分离功能高分子材料国家重点实验室 天津 300071
  • 收稿日期:1997-09-26 修回日期:1998-01-12 出版日期:1998-08-10 发布日期:1998-08-10

Study on the Reaction Mechanism of Epoxy Resin/Dicyanamide System

Zhang Baolong, Shi Keyu, You Yingcai, Zhou Deliang, Du Zongjie, Huang Jifu   

  1. Department of Chemistry, The State Key Laboratory of Functional Polymer Materials for Adsorption and Separation, Nankai University, Tianjin 300071
  • Received:1997-09-26 Revised:1998-01-12 Published:1998-08-10 Online:1998-08-10

摘要: 双氰胺作为环氧树脂的固化剂,由于固化产物具有优良的机械和电性能,广泛应用在汽车、航天及电子等领域中.但由于其固化温度高达180℃以上,使应用范围受到很大限制.专利文献曾报道脉衍生物作为环氧树脂/双氰胺固化体系的促进剂,可以使体系的固化温度降低到130~140℃,并且在室温下仍保持一定的潜伏性[1,2].

关键词: 取代脲, 环氧树脂, 双氰胺, 固化反应

Abstract: The reaction mechanism, reactivities, and apparent activation energies of epoxy/dicyanamide curing system accelerated by C6H5NHCONR2 (R=CH3, n-C4H9, i-C3H7) werestudied by DSC and GC techniques.The results showed that in reaction of C6H5,NHCONR2 with either dicyanamide or epoxy resin there was a dimethylamine released reacting with epoxy resin, giving a tertiary amine, which accelerated the anionic homopolymerization of epoxy resin.

Key words: substituted urea, epoxy resin, dicyandiamide, curing reaction