Preparation and Properties of Al2O3-Modified Epoxy Resin for Electronic Packaging

doi:10.3724/SP.J.1095.2013.30259

Chinese Journal of Applied Chemistry

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Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging

LIU Changling^*, YANG Ning, ZHANG Zeyu

(Fine Mechanics and Physics,Changchun Insitute of Optics,Chinese Academy of Sciences,Changchun 130033,China)

Received:2013-05-21 Revised:2013-07-02 Published:2013-12-10 Online:2013-12-10

Abstract

Abstract: Thermal conductivity, thermal expansion coefficient and dielectric constant of liquid epoxy resin filled with Al2O3 flakes or particles in single, binary or multiple hybrid particle sizes were investigated. The relationship between enhanced thermal performance and dense packing was studied by the fractal theory. The results show that the modified epoxy resin filled with single Al2O3 flakes or particles(~48 μm) exhibit superior comprehensive performance. The best thermal conductivity, dielectric constant and thermal expansion coefficient are obtained when the epoxy resin filled with the binary hybrid particles, where the volume fraction of the smaller particles in the mixed particles is 20%~40%. The particles in various sizes in a close packing pattern form the relatively minimum gap and the highest relative thermal conductivity is obtained when the fractal dimension D value of hybrid particle size is in a suitable range.

Key words: Al2O3, grain shape, modified epoxy resin, thermal conductivity, thermal expansion coefficient, dielectric constant,fractal theory

CLC Number:

O631.2

LIU Changling*, YANG Ning, ZHANG Zeyu. Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging[J]. Chinese Journal of Applied Chemistry, DOI: 10.3724/SP.J.1095.2013.30259.

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Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging

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