Application of Polyether Amines in Copper Barrier Chemical Mechanical Polishing Slurry

doi:10.19894/j.issn.1000-0518.210562

Chinese Journal of Applied Chemistry ›› 2022, Vol. 39 ›› Issue (10): 1579-1585.DOI: 10.19894/j.issn.1000-0518.210562

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Application of Polyether Amines in Copper Barrier Chemical Mechanical Polishing Slurry

Lin LIU¹(), Hua-Feng HE¹^,²()

^1.School of Materials Science and Engineering，Tongji University，Shanghai 200092，China
^2.Anji Microelectronics （Shanghai） Co. ，Ltd. ，Shanghai 201203，China

Received:2021-12-10 Accepted:2022-04-21 Published:2022-10-01 Online:2022-10-05
Contact: Lin LIU,Hua-Feng HE
About author:garyhe@anjimicro.com
llsp@tongji.edu.cn；

Abstract

Abstract:

The low-k dielectric materials with their low mechanical strength and high porosity for advanced IC processes pose great challenges in barrier CMP slurries， requiring favorable advantages in high removal rate， adjustability， lower surface defects and improved edge over erosion （EOE）. In this paper， the effects of polyether amines on the removal rate and defects toward low-k materials are studied. The results show that the removal rate of low-k material decreases by 68%~85%， the number of residual particles on the surface of low-k material decreases by 80%， and EOE decreases by 2/3， which meets the requirements of advanced technology for barrier CMP slurries.

Key words: Polyether amine, Chemical mechanical polishing, Copper barrier materials

CLC Number:

O649.2

Lin LIU, Hua-Feng HE. Application of Polyether Amines in Copper Barrier Chemical Mechanical Polishing Slurry[J]. Chinese Journal of Applied Chemistry, 2022, 39(10): 1579-1585.

Figures/Tables 6

Fig.1 Effects of polyether amines on the removal rate of wafers

Fig.2 Contact angles of BDⅠ and BDⅡ to polyether amines

Fig.3 Effect of mass fraction of polyether diamine on the removal rate of SiO2/BDⅠ/BDⅡ

Fig.4 Effect of mass fraction of polyether diamine on surface defect of BDⅠ/BDⅡ

Table 1 Effect of mass fraction of polyether diamine on barrier slurry particle size and PDI

聚醚二胺质量分数 Mass fraction of polyether diamine/%	平均粒径 Mean size/nm	多分散系数 PDI
0.00	79.6	0.103
0.03	78.6	0.056
0.05	78.2	0.021
0.10	79.1	0.023

Fig.5 Effect of polyether diamine on the EOE defect of patterned wafers

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Application of Polyether Amines in Copper Barrier Chemical Mechanical Polishing Slurry

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