Chinese Journal of Applied Chemistry ›› 1994, Vol. 0 ›› Issue (1): 63-66.

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Kinetics of Thermal Degradation of Boron-Containing Phenol-Formaldehyde Resin

Gao Jungang, Liu Yanfang   

  1. Department of Chemistry, Hebei University, Baoding 071002
  • Received:1993-03-16 Published:1994-02-10 Online:1994-02-10

Abstract: The kinetics of thermal degradation and thermal stability of boron-containing phe-nol-formaldehyde resin were investigated by thermal analysis and infrared spectroscopy. The resins showed a higher decomposition temperature and oxidative resistance than common phenol-formaldehyde resins due to the presence of benzyl borate as well as phenyl borate linkages after curing.

Key words: boron-containing phenol-formaldehyde resin, thermal decomposition, kineties