Chinese Journal of Applied Chemistry

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Preparation of Palladium(Ⅱ) Chloride-dopped Carboxylic Styrene Butadiene Latex Film for Electroless Copper Plating

ZHANG Jiajia1, YU Dan1,2, WANG Wei1*   

  1. (1.College of Chemistry,Chemical Engineering and Biotechnology;
    2.National Engineering Research Center for Dyeing and Finishing of Textiles,
    Donghua University,Shanghai 201620,China)
  • Received:2013-07-01 Revised:2013-09-23 Published:2014-05-10 Online:2014-05-10

Abstract: The electroless plating of copper on the palladium(Ⅱ) chloride-dopped carboxylic styrene butadiene latex film was investigated. Cu2+ was reduced to Cu for directional deposition of copper particles on the film surface. The copper coating was characterized by scanning electron microscopy(SEM), X-ray diffraction(XRD), and energy-disperse spectroscopy(EDS). The rate of mass gain and deposition were also measured. These results indicate that the copper coating is uniform and compact on the film, and allows broad applications of this method.

Key words: carboxylic styrene butadiene latex, autocatalytic, electroless copper plating, electrical conductivity, fastness

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