电子封装用Al2O3改性环氧树脂及其性能

doi:10.3724/SP.J.1095.2013.30259

摘要/Abstract

摘要： 将不同粒径和形状的Al2O3混合颗粒填充到液态环氧树脂中，研究了单一粒径、二元混合粒径和多元混合粒径填充对固化环氧树脂复合材料的热导率、热膨胀系数和介电常数的影响。通过分形理论探讨了填料的密堆积与复合材料导热性能的关系。结果表明，单一片状及直径48 μm的粒状Al2O3填充环氧树脂复合材料，具有较好的综合性能；对二元混合粒径填料，小粒子用量占填料总体积的20%～40%之间时，获得的复合材料的热导率、介电常数和热膨胀系数均能达到最佳值；混合粒子中粒径分布的分数维D值在某一适宜区间时，不同粒径的粒子之间可形成空隙率相对最小的紧密堆积，从而可获得热导率相对较高的复合材料。

关键词: Al2O3, 粒径形态, 改性环氧树脂, 热导率, 热膨胀系数, 介电常数, 分形理论

Abstract: Thermal conductivity, thermal expansion coefficient and dielectric constant of liquid epoxy resin filled with Al2O3 flakes or particles in single, binary or multiple hybrid particle sizes were investigated. The relationship between enhanced thermal performance and dense packing was studied by the fractal theory. The results show that the modified epoxy resin filled with single Al2O3 flakes or particles(~48 μm) exhibit superior comprehensive performance. The best thermal conductivity, dielectric constant and thermal expansion coefficient are obtained when the epoxy resin filled with the binary hybrid particles, where the volume fraction of the smaller particles in the mixed particles is 20%~40%. The particles in various sizes in a close packing pattern form the relatively minimum gap and the highest relative thermal conductivity is obtained when the fractal dimension D value of hybrid particle size is in a suitable range.

Key words: Al2O3, grain shape, modified epoxy resin, thermal conductivity, thermal expansion coefficient, dielectric constant,fractal theory

中图分类号:

O631.2

刘长岭, 杨宁, 张泽宇. 电子封装用Al₂O₃改性环氧树脂及其性能[J]. 应用化学, DOI: 10.3724/SP.J.1095.2013.30259.

LIU Changling*, YANG Ning, ZHANG Zeyu. Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging[J]. Chinese Journal of Applied Chemistry, DOI: 10.3724/SP.J.1095.2013.30259.

参考文献

[1] HA Enhua,KOU Kaichang,CHEN Lixin. Research Progress on Epoxy Resin Packaging Materials[J]. Chem Ind Prog,2003,22(1):1057-1060(in Chinese).

哈恩华,寇开昌,陈立新. 环氧灌封材料的研究进展[J]. 化工进展,2003,22(1):1057-1060.

[2] HE Bingbing,FU Renli,JIANG Li. Study of Ceramic Filler for Use in Liquid Epoxy Resin for Electronic Packaging[J]. China Plast Ind,2011,39(5):46-49(in Chinese).

何兵兵,傅仁利,江利. 电子封装液体环氧树脂中陶瓷填料的改性研究[J]. 中国塑料工业,2001,39(5):46-49.

[3] JIAN Bencheng,CHEN Yan. Effect of Alumina Filler Preperties on the Functions of Epoxy Resin Moulding Product[J]. Mod Ceram Tech,2004,(4):18-20(in Chinese).

简本成,陈燕. 氧化铝填料性能对环氧树脂浇锗制品性能的影响[J]. 现代陶瓷技术,2004,(4):18-20.

[4] JIAN Bencheng,LI Bin. Applications of Al2O3 as the Moulding Filler of Epoxy Resin[J]. Light Met,2001,(8):21-23(in Chinese).

简本成,李滨. Al2O3作为环氧浇铸用填料的应用[J]. 轻金属,2001,(8):21-23.

[5] He H,Fu R L,Han Y C. High Thermal Conductivity Si3N4 Particle Filled Epoxy Composites with a Novel Structure[J]. J Electron Packaging,2007,129:2-3.

[6] DING Feng,XIE Weizhang. Thermal Conductivity of Composites[J]. Acta Mater Compos Sin,1993,10(3):21-23(in Chinese).

丁峰,谢维章. 导热树脂基复合材料[J]. 复合材料学报,1993,10(3):21-23.

[7] ZHOU Wenying,QI Shuhua,TU Chunchao,et al. Study on Thermal Conductivity of Silicone Rubber Composite Materials[J]. J Aeronaut Mater,2007,27(1):33-36(in Chinese).

周文英,齐暑华,涂春潮,等. 导热硅橡胶复合材料研究[J]. 航空材料学报,2007,27(1):33-36.

[8] Cumberland D J,Crawford R J. Handbook of Powder Technology[M]. Amsterdam:Elsevier Science Publishers,Vol.6,Chap.4,1987.

[9] PAN Dahai,LIU Hai. Effects of Corundum Powder on the Performance of RTV Silicone Rubber[J]. Silicone Mater,2004,18(6):9-12(in Chinese).

潘大海,刘海. 刚玉粉对室温硫化导热硅橡胶性能的影响[J]. 有机硅材料,2004,18(6):9-12.

[10] WANG Buxuan,ZHOU Leping,PENG Xiaofeng. Fractal Model for Effective Thermal Conductivity of Nanoparticle Suspension[J]. Prog Nat Sci,2003,13(9):838-842(in Chinese).

王补宣,周乐平,彭晓峰. 纳米颗粒悬浮液有效导热系数的分形模型[J]. 自然科学进展,2003,13(9):838-842.

[11] ZHAO Lan,PING Xulie. Fractal Model of Contact Heat Transfer Between Solid Interfaces[J]. J Tongji Univ,2003,31(3):296-299(in Chinese).

赵兰,萍徐烈. 固体界面间接触导热的分形模型[J]. 同济大学学报,2003,31(3):296-299.

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电子封装用Al₂O₃改性环氧树脂及其性能

Preparation and Properties of Al₂O₃-Modified Epoxy Resin for Electronic Packaging

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