应用化学 ›› 2018, Vol. 35 ›› Issue (11): 1289-1294.DOI: 10.11944/j.issn.1000-0518.2018.11.170409

• 研究论文 • 上一篇    下一篇

含三苯基氧磷结构聚芳醚醚酮酮的合成与表征

刘勇军,钟鸣,宋琤(),盛寿日,侯豪情,宋才生   

  1. 江西师范大学化学化工学院 南昌 330022
  • 收稿日期:2017-11-14 接受日期:2018-02-05 出版日期:2018-10-31 发布日期:2018-10-31
  • 通讯作者: 宋琤
  • 基金资助:
    国家自然基金(51663011),江西省高等学校科技落地计划项目(KJLD14022),江西省教育厅科学技术研究项目(GJJ12214)资助

Synthesis and Characterization of Poly(aryl ether ether ketone ketone) Containing Phenyl Phosphine Oxide

LIU Yongjun,ZHONG Ming,SONG Cheng(),SHENG Shouri,HOU Haoqing,SONG Caisheng   

  1. School of Chemistry and Chemical Engineering,Jiangxi Normal University,Nanchang 330027,China
  • Received:2017-11-14 Accepted:2018-02-05 Published:2018-10-31 Online:2018-10-31
  • Contact: SONG Cheng
  • Supported by:
    Supported by the National Natural Science Foundation of China(No.51663011), the Science and Technology Landing Program Project of Jiangxi's Universities(No.KJLD14022), the Department of Education, Research Program of Jiangxi Province(No.GJJ12214)

摘要:

以苯酚、对二溴苯及苯基磷酰二氯为原料合成出二(4-苯氧基苯基)苯基氧磷(BPOPPO)。 三氯化铝(AlCl3)为催化剂,通过缩聚反应,BPOPPO与对苯二甲酰氯(TPC)反应制备出一种含有三苯基氧磷结构的聚醚醚酮酮(P-PEEKK)树脂。 采用傅里叶变换红外光谱仪(FT-IR)、差示扫描量热仪(DSC)、热重分析仪(TGA)和广角X射线衍射(WAXD)等技术手段对P-PEEKK树脂的结构和性能进行表征。 结果表明,P-PEEKK树脂属于非晶聚合物,玻璃化转变温度(Tg)较高,为190.5 ℃;热分解温度(T5%)为515 ℃,耐热性能较好;极限氧指数(LOI)为42,阻燃性能好,为难燃材料;易溶解于氯仿、1,2-二氯乙烷、N,N-二甲基乙酰胺等有机溶剂中,溶解性能较好,便于涂膜加工;拉伸强度为62 MPa,力学性能较好。

关键词: 二(苯氧基苯基)苯基氧磷, 对苯二甲酰氯, 聚芳醚醚酮酮

Abstract:

A kind of poly(aryl ether ether ketone ketone) containing phenyl phosphine oxide structure(P-PEEKK) was synthesized by polycondensation of bis(4-phenoxy phenyl) phenyl phosphine oxide(BPOPPO) synthesized from phenol, 1,4-dibromobenzene and phenylphosphonic dichloride as raw materials and terephthaloyl chloride(TPC) with aluminum chloride(AlCl3) as the catalyst. The structure and properties of P-PEEKK resin were characterized by Fourier transform infrared spectroscopy(FT-IR), differential scanning calorimetry(DSC), thermogravimetric analyzer(TGA) and wide-angle X-ray diffraction(WAXD), etc. The results show that P-PEEKK resin is amorphous with a high glass transition temperature(Tg) of 190.5 ℃, a thermal decomposition temperature(T5%) of 515 ℃ , limiting oxygen index(LOI) of 42 and tensile strength of 62 MPa, and is soluble in chloroform, 1,2-dichloroethane, N,N-dimethylacetamide and other organic solvents for coating film.

Key words: bis(phenoxy phenyl) phenyl phosphine oxide, terephthaloyl chloride, poly(aryl ether ether ketone ketone)