关键词: As(Ⅴ), Sb(Ⅲ), Bi(Ⅲ), 电解法制铜, 交换电流密度, 极化, 晶面择优取向

Abstract: The effects of As(Ⅴ), Sb(Ⅲ) and Bi(Ⅲ) on the kinetics of the cathodic copper deposition reaction in acidified CuSO₄ have been investigated by linear potential sweep method, XPS and XRD. The results indicated that As(Ⅴ) ions increased the density of exchange current of copper deposition reaction and had done an action of unpolarization on the process of copper deposition. Sb(Ⅲ) and Bi(Ⅲ) ions, on the contrary, decreased the density of exchange current and had an action of polarization on the process of copper deposition. As, Sb and Bi ions showed no influence on the reaction mechanism of copper deposition. They did not deposite on the cathode when electrolysis was at 200 A/m², they also did not effect on the copper deposition predominant crystal orientation(220). As and Bi co-deposited on the cathode with Cu when electrolysis was at 1500 A/m², with copper deposition predominant crystal orientation being changed into (111). Copper deposited in the form of metal Cu and few in Cu₂O. Bismuth was in the form of Bi₂O₃.

Key words: arsenic, antimony, bismuth, electrorefining copper, exchange current density, polarization, predominant crystal orientation