中华医学超声杂志

应用化学

• 研究论文 • 上一篇    下一篇

聚异酰亚胺树脂合成条件的优化

杨秀云1,崔婷婷1,李云辉1,孟祥胜2,杨慧丽2,范卫锋2,刘敬峰2,王震2*   

  1. (1.长春理工大学化学与环境工程学院 长春 130022；
    2.中国科学院长春应用化学研究所高分子复合材料工程实验室 长春 130022)
  • 收稿日期:2011-08-30 修回日期:2011-10-25 出版日期:2012-08-10 发布日期:2012-08-10
  • 通讯作者: 王震,研究员; Tel:0431-85262737; Fax:0431-85262682; E-mail:wangzhen@ciac.jl.cn; 研究方向：聚酰亚胺材料
  • 基金资助:
    国家自然科学基金资助项目(51173178);国家“九七三”项目（2010CB631100）

Optimizing the Synthetic Conditions of Polyisoimide Resins

YANG Xiuyun1, CUI Tingting1, LI Yunhui1, MENG Xiangsheng2, YANG Huili2, FAN Weifeng2, LIU Jingfeng2, WANG Zhen2*   

  1. (1.School of Chemistry and Environmental Engineering,Changchun University of Science and Technology,Changchun,China;
    2.The Engineering Laboratory of Polymer Composite,Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,Changchun 130022,China)
  • Received:2011-08-30 Revised:2011-10-25 Published:2012-08-10 Online:2012-08-10

PDF

1196

被引次数

3

摘要： 采用不同溶剂制备了苯乙炔基封端的聚异酰亚胺树脂，探讨了不同处理温度对聚异酰亚胺树脂(PⅡ)和相应的聚酰亚胺树脂(PⅠ)的熔体粘度及溶解性的影响。 结果表明，不同处理温度对PⅡ的熔体黏度影响不大，但对溶解性有一定的影响，PⅡ在NMP和THF中具有良好的溶解性能。 在相同处理温度条件下，PⅡ的熔体黏度低于PⅠ。 随处理温度的增加，PⅡ低聚物的T5%随之增加，PⅡ在110 ℃处理的T5%为208 ℃，150 ℃处理的T5%为323 ℃，180 ℃处理的T5%为382 ℃，PⅡ固化后的T5%为550 ℃，显示出较优异的耐热性能。

关键词: 聚异酰亚胺, 聚酰亚胺, 溶解性, 黏度

Abstract: Phenylethynyl end-capped polyisoimide oligomers were synthesized in different solvents. The effects of different treatment temperature on melting viscosity and solubility of polyisoimide(PⅡ) and its corresponding polyimide(PⅠ) resins were discussed. The results showed that the effect of treatment temperature on melting viscosity of PⅡ was marginal but conceivable on solubility. The PⅡ exhibited excellent solubility in N-methylpyrrolidone(NMP) and tetrahydrofuran(THF). The PⅡ had less melt viscosity than PⅠ at same treatment temperature. The T5% of PⅡ oligomer increased with the elevation of treatment temperature. The T5% is 208 ℃, 323 ℃ and 382 ℃ when the temperature of PⅡ treatment is 110 ℃, 150 ℃ and 180 ℃, respectively. While the T5% of cured PⅡ is 550 ℃ suggesting that had excellent heat resistance.

Key words: polyisoimide, polyimide, solubility, viscosity

中图分类号: 

网站版权 © 应用化学     本网站备案：吉ICP备12000082号