Chinese Journal of Applied Chemistry

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搅拌条件下电流密度对Cu镀层的结构和表面形貌的影响

辜敏a;b;;黄令b;杨防祖b;姚士冰b;周绍民b   

  1. 汕头大学,厦门大学
  • Received:2009-06-29 Revised:2009-06-29 Published:2002-03-10 Online:2002-03-10
  • Contact: 辜敏a;b;;黄令b;杨防祖b;姚士冰b;周绍民b

Abstract: 电沉积;晶体取向;搅拌条件下电流密度对Cu镀层的结构和表面形貌的影响

CLC Number: