The Curing Process of Epoxy Resin Tooling Board for Slush Mold at Different Temperature

doi:10.11944/j.issn.1000-0518.2016.03.150230

Chinese Journal of Applied Chemistry ›› 2016, Vol. 33 ›› Issue (3): 299-306.DOI: 10.11944/j.issn.1000-0518.2016.03.150230

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The Curing Process of Epoxy Resin Tooling Board for Slush Mold at Different Temperature

ZHANG Huanhuan^b^c,XU Donghua^b,GUAN Dongbo^a,YAO Weiguo^a^*(),SHI Tongfei^b^*()

^aKey Laboratory of Automobile Materials,Ministry of Education,College of Materials Science and Engineering,Jilin University,Changchun 130025,China
^bState Key Laboratory of Polymer Physics and Chemistry,Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,Changchun 130022,China
^cUniversity of Chinese Academy of Sciences,Beijing 100049,China

Received:2015-07-06 Accepted:2015-12-03 Published:2016-03-02 Online:2016-03-02
Contact: YAO Weiguo,SHI Tongfei
Supported by:
Supported by the National Natural Science Foundation of China(No.21274152, No.51473168, No.21234007, No.21174146), the Special Funds for National Basic Research Program of China(No.2010CB631100), Science and Technology Development Program of Jilin Province(No.20120319), the Program of Key Technology Researchfor the Slush Process of Automotive Interior Product(No.2012362)

Abstract

Abstract:

The curing process of epoxy resin tooling board for slush mold with different temperature was studied by the rheological method. To find the suitable test condition, the influence of strain and oscillatory frequency on the curing process of epoxy resin tooling board for slush mold was investigated firstly. During the process of curing, the degree of curing becomes larger with time. However, for different stages, the curing rate is different, from slow to fast and finally becomes slow again until plateau. This variation trend is also similar with the storage modulus and loss modulus. On the basis of the relation between the maximum increasing speed of modulus and the reaction temperature, the activation energy of epoxy resin tooling board for slush mold is calculated to be 27.2 kJ/mol. As the reaction temperature increases, the curing rate of the two-component epoxy resin for slush mold speeds up and less time is needed to finish the curing reaction of the epoxy resin. At the same time, the time which can be used to handle the epoxy resin for making mold becomes less with the increase of temperature.

Key words: epoxy resin, slush mold, curing, rheological properties

ZHANG Huanhuan, XU Donghua, GUAN Dongbo, YAO Weiguo, SHI Tongfei. The Curing Process of Epoxy Resin Tooling Board for Slush Mold at Different Temperature[J]. Chinese Journal of Applied Chemistry, 2016, 33(3): 299-306.

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The Curing Process of Epoxy Resin Tooling Board for Slush Mold at Different Temperature

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