Chinese Journal of Applied Chemistry ›› 1987, Vol. 0 ›› Issue (4): 12-15.

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ON A.C.ETCHING OF ALUMINUM FOIL IN HYDROCHLORIC ACID Ⅳ.EFFECT OF ORGANIC ACID ADDITIVES

Yan Kangping1, Shen Xingsu2   

  1. 1. Department of Chemical Engineering, Chengdu University of Science and Technology;
    2. Changchun Institute of Applied Chemistry, Academia Sinica
  • Received:1986-02-15 Revised:1986-05-29 Published:1987-08-10 Online:1987-08-10

Abstract: Nine organic acids including monoacid, diacid and hydroxycarboxylic acid were used as additives in a. c. etching of aluminum foil in hydrochloric acid medium. The results show,as reported in previous paper with additives of sulfuric acid that these additives are essential in formation of a compact etch film, which is broken through during each anodic cycle of the ac-current, thus a high density of etch pits and a large surface area magnification can be obtained. For a certain a. c. frequency there exists an optimum additive concentration Cm,the greater the first dissociation constant of the acid, the lower the Cm. Cm also decreases with increase of a. c. frequency. It is proposed, that the organic acid anion was competitively adsorbed with (Cl-) ion, forming a buffer layer, which decreases the solubility of etch film. The effects of the concentration of hydrochloric acid, the current density of a. c. and the overall concentration of Cl- ion on etching process were also discussed.