中华医学超声杂志

应用化学

• 研究论文 • 上一篇    下一篇

环氧树脂导电胶用铜粉抗氧化性

代仕梅,韩广帅,杜财钢,高延敏*   

  1. (江苏科技大学材料科学与工程学院 镇江 212003)
  • 收稿日期:2012-08-23 修回日期:2012-11-01 出版日期:2013-06-10 发布日期:2013-06-10
  • 通讯作者: 高延敏，教授; Tel/Fax:0511-84497908; E-mail:gao-y-m12@sohu.com; 研究方向：金属腐蚀与防护，复合材料

Anti-oxidation of Epoxy Resin Conductive Adhesive Copper Powder

DAI Shimei, HAN Guangshuai, DU Caigang, GAO Yanmin*   

  1. (School of Materials Science and Engineering,Jiangsu University of Science and Technology,Zhenjiang 212003,China)
  • Received:2012-08-23 Revised:2012-11-01 Published:2013-06-10 Online:2013-06-10

PDF

2782

被引次数

17 | 3

摘要： 根据铜本身具有的性质，选用γ-氨丙基甲基二乙氧基硅烷（KH-902）对铜粉进行改性，并采用FT-IR、超景深显微镜、TG、SEM及EDS技术对改性铜粉及铜粉导电胶进行表征。 结果表明，添加硅烷偶联剂KH-902可以有效改善铜粉的易氧化的问题，当添加量为3%时，不仅可以明显改善铜粉导电胶在高温固化下抗氧化性能，而且铜粉在环氧树脂胶体体系中能够均匀分散，且铜粉与铜粉之间的搭接紧密，具有良好的导电性能，体积电阻率仅1.31×10-2 Ω·cm。

关键词: 导电胶, 铜粉, 硅烷偶联剂, 抗氧化性

Abstract: According to the nature of copper, γ-amino propyl methyl di-ethoxy-silane(KH-902) is selected to modify copper. FT-IR, digital microscope, TG, SEM and EDS have been used to characterize the modified copper and the copper-filled conductive adhesive. The results show that the addition of silane coupling agent KH-902 can improve the antioxidation ability. When the addition of KH-902 is 3%, it can significantly improve not only the oxidation resistance of the copperfilled conductive adhesive in high temperature curing, but also the dispersion of copper in the epoxy resin colloid system, and make the combination between copper and copper better, which is the superior conductivity of system with bulk resistance rate of 1.31×10-2 Ω·cm.

Key words: Filled Conductive Adhesive, copper, silane coupling agent, oxidation resistance

中图分类号: 

网站版权 © 应用化学     本网站备案：吉ICP备12000082号