应用化学 ›› 1995, Vol. 0 ›› Issue (6): 50-52.

• 研究论文 • 上一篇    下一篇

加速剂对化学镀镍层组成与结构的影响

方景礼, 武勇, 韩克平, 张敏   

  1. 南京大学应用化学研究所配位化学国家重点实验室, 南京 210093
  • 收稿日期:1994-12-11 修回日期:1995-05-22 出版日期:1995-12-10 发布日期:1995-12-10

The Effect of Accelerator on the Composition and Structure of Chemically Plated Nickel Deposit

Fang Jingli, Wu Yong, Han Keping, Zhang Min   

  1. Institute of Applied Chemistry, State Key Laboratory of Coordination Chemistry, Nanjing University, Nanjing 210093
  • Received:1994-12-11 Revised:1995-05-22 Published:1995-12-10 Online:1995-12-10

摘要: 化学镀镍磷合金具有耐蚀性、可焊性、厚度均匀和硬度高等优点.已得到广泛应用.为提高生产效率,超高速化学镀镍成为人们关注的新课题,采用沉积速度达23~27μm/h,以满足机械、电子、化工和印刷等对较厚化学镀镍层的要求.

关键词: 化学镀镍, Ni0P合金, 加速剂, 硫脲

Abstract: The effect of organic sulfur accelerator on the deposition rate of chemical nickel-plating and on the oxidation rate of sodium hypophosphite was studied.It is found that theacceleration mechanism is due to the catalytic action of accelerator for the oxidation of hy-pophosphite, The results of XPS Indicate that the coating is composed of Ni and Ni2P alloy.The composition (relative atomic concentration %)of the Ni-P coating are Ni 74.3%,P 18.3%,O 5.8% and S 1.6% as obtained from the AES depth profile ctirves.

Key words: chemical nickel-plating, Ni-P alloy, accelerator, thiourea