中华医学超声杂志

应用化学 ›› 2010, Vol. 27 ›› Issue (10): 1129-1132.DOI: 10.3724/SP.J.1095.2010.90746

• 研究论文 • 上一篇    下一篇

界面键接的茂金属聚乙烯/聚合型改性蒙脱土纳米复合材料的超临界二氧化碳发泡

任昌义,张振江,邢海平,唐涛*   

  1. (高分子物理与化学国家重点实验室，中国科学院长春应用化学研究所 长春 130022)
  • 收稿日期:2009-11-12 修回日期:2010-02-08 出版日期:2010-10-10 发布日期:2010-10-10
  • 通讯作者: 唐涛，男，研究员，博士生导师; E-mail:ttang@ciac.jl.cn; 研究方向：聚合物共混、聚合物纳米复合材料、烯烃聚合与催化剂
  • 基金资助:
    国家自然科学基金（505253115062130220734006和50873099）资助项目

The Foam of Metallocene Catalyzed Polyethylene/Polymerizable Montmoillonite Nanocomposite with Bonded Interface Using Supercritical Carbon Dioxide as Foaming Agent

REN Chang-Yi, ZHANG Zhen-Jiang, XING Hai-Ping, TANG Tao*   

  1. (State Key Laboratory of Polymer Physics and Chemistry,Changchun Institute of
    Applied Chemistry,Chinese Academy of Sciences,Changchun 130022)
  • Received:2009-11-12 Revised:2010-02-08 Published:2010-10-10 Online:2010-10-10

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摘要：

研究了界面具有化学键接的茂金属聚乙烯/聚合型改性蒙脱土（mPE/P-MMT）纳米复合材料的流变学行为。 结果表明，与均聚聚乙烯及非界面键接的茂金属聚乙烯/十二铵改性蒙脱土（mPE/12-MMT）复合材料相比，mPE/P-MMT纳米复合材料具备由聚乙烯基体与P-MMT所组成的网络结构，因此具有较高的熔体强度(在190 ℃时的熔体强度为12.0 cN)。 用超临界二氧化碳作发泡剂对它们的发泡性能进行对比，mPE/P-MMT纳米复合材料具有更高的发泡倍率(可达14.7)，其最佳发泡温度为142 ℃。

关键词: 茂金属聚乙烯, 纳米复合材料, 发泡, 流变

Abstract:

The rheological behavior of interfacebonded metallocene and polyethylene/polymerizable modified montmoillonite(mPE/P-MMT) nanocomposite had been studied. It was found that there was cross-linking structure formed by PE matrix and P-MMTs; and mPE/P-MMT nanocomposite had higher melting strength compared with mPE matrix and conventional metallocene bonded polyethylene/dodecylammonium modified montmoillonite(mPE/12-MMT) composite. The melting strength of mPE/P-MMT at 190 ℃ was 12.0 cN. Supercritical carbon dioxide was used as foaming agent for foaming the samples. According to the results, higher volume expansion ratio, as much as 14.7, was obtained for the mPE/P-MMT sample compared with others. The optimum temperature for the foaming process on mPE/P-MMT nanocomposite was 142 ℃.

Key words: metallocene catalyzed polyethylene, nanocomposite, foam, rheology

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