Chinese Journal of Applied Chemistry

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Electrodeposition Behaviors of Copper in Ionic Liquid

GAO Wei, LIU Ruiquan*, MI Hongyu   

  1. (College of Chemistry and Chemical Engineering,Xinjiang University,Urumqi 830046,China)
  • Received:2013-03-15 Revised:2013-04-07 Published:2014-02-10 Online:2014-02-10
  • Contact: wei gao

Abstract: The electrodeposition of metallic copper in the solution of ethylene glycol(EG) and 1-butyl-3-methylimidazolium chloride(BMIC) containing CuCl2 was studied. The effect of EG on the viscosity and the effect of BMIC on the conductivity were investigated. Cyclic voltammetry was performed to study the electrodeposition of Cu(Ⅱ) in BMIC-CuCl2-EG. The electrodeposition of Cu(Ⅱ) was affected by the scanning rate, temperature and the content of EG. The reduction of Cu(Ⅱ) consistes of two processes. Both the redox processes of Cu(Ⅱ)/Cu(Ⅰ) and Cu(Ⅰ)/Cu are irreversible, in which Cu(Ⅱ)/Cu(Ⅰ) is under the control of diffusion. The diffusion coefficient of Cu(Ⅱ)/Cu(Ⅰ) is calculated to be 7.0×10-7 cm2/s and the transfer coefficient to be 0.24 at the temperature of 343 K. The metallic copper grains were electrodeposited on the copper film. Based on the scanning electron microscope micrographs, these grains demonstrate the dense location after the electrodeposition for 30 minutes at 343 K. These grains turn into globular morphology after the electrodeposition for 2 h.

Key words: cyclic voltammetry, butyl-methylimidazolium chloride, copper, electrodeposition, ethylene glycol

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